Technical data:
galvanic separation of the heating plate from the network
Size heated surface:
80 x 50 mm
Temperature range:
50 °C - 200 °C ESD safe
Details
WHP 80 - preheating plate 24 V / 80 Wheated surface 80 x 50 mm
temperature range 50 ° C - 200 ° C
Connection to:
WS 81, WSD 81, WSD 161, WSD 151, WMD 1D, WMD 3
- Power Power
- 80 W
- Temperature range Temperature range
- 50 - 200 °C
Soldering with hot air does not take place with conventional solder, but using solder paste. The solder paste is applied on the solder joint with appropriate dispensers. The soldering process is made contactlessly with hot air. Some specifics have to be considered also during the desoldering process with hot air. Smaller components are evenly heated with the hot air pencil, and then lifted. There is a wide range of offered nozzles for the desoldering of larger components. First, in stand-by mode, the component is gently preheated with contact heat by a plate that is built into a nozzle. Then, the full heating capacity with higher air flow is switched on for only a few seconds. The air flow is directed exactly to the component connections due to the construction of the nozzle. The device can be lifted with the built-in vacuum (WHA 3000V / WHA 3000P) or with a vacuum pipette. The vacuum is configured in such a way that the device can be lifted, but there is no danger to remove pads of the printed circuit board by too much traction. So desoldering with hot air is a gentle process for the component as well as for the PCB. There are no thermal or mechanical damages.
Downloads
- Please log in to download datasheets! :
- There are several datasheets for this product. Please log in!
